Issued Patents 2017
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9816193 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | Kousik Ganesan, Tighe A. Spurlin, Jonathan D. Reid, Andrew John McKerrow, James E. Duncan | 2017-11-14 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9816194 | Control of electrolyte flow dynamics for uniform electroplating | Zhian He, Jian Zhou, Jingbin Feng, Jonathan D. Reid | 2017-11-14 |
| 9735035 | Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensing | Manish Ranjan, Cian Sweeney | 2017-08-15 |
| 9685353 | Apparatus and method for edge bevel removal of copper from silicon wafers | Kousik Ganesan, Tariq Majid, Aaron Louis LaBrie, Steven T. Mayer | 2017-06-20 |
| 9677190 | Membrane design for reducing defects in electroplating systems | Doyeon KIM, Yuichi Takada, Ludan Huang, Tariq Majid | 2017-06-13 |
| 9587322 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew | 2017-03-07 |