Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Lee J. Brogan, James E. Duncan +9 more | 2017-11-14 |
| 9689083 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Joseph Richardson, David W. Porter, Haiying Fu | 2017-06-27 |
| 9617648 | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias | Steven T. Mayer | 2017-04-11 |