Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852913 | Wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey | 2017-12-26 |
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Bryan L. Buckalew, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo +1 more | 2017-12-05 |
| 9822461 | Dynamic current distribution control apparatus and method for wafer electroplating | Zhian He, Jonathan D. Reid, Frederick Dean Wilmot | 2017-11-21 |
| 9816196 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | Tighe A. Spurlin, Charles Merrill, Ludan Huang, Matthew Thorum, Lee J. Brogan +9 more | 2017-11-14 |
| 9721800 | Apparatus for wetting pretreatment for enhanced damascene metal filling | Steven T. Mayer, Mark J. Willey, Robert Rash | 2017-08-01 |
| 9689083 | TSV bath evaluation using field versus feature contrast | Lee J. Brogan, Steven T. Mayer, Matthew Thorum, Joseph Richardson, Haiying Fu | 2017-06-27 |
| 9677188 | Electrofill vacuum plating cell | R. Marshall Stowell, Jingbin Feng | 2017-06-13 |
| 9617652 | Bubble and foam solutions using a completely immersed air-free feedback flow control valve | Richard Abraham, Robert Rash, Steven T. Mayer, John Floyd Ostrowski | 2017-04-11 |
| 9534308 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, Steven T. Mayer, Thomas A. Ponnuswamy | 2017-01-03 |