Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9834852 | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy, Hilton Diaz Camilo, Robert Rash +1 more | 2017-12-05 |
| 9828688 | Methods and apparatus for wetting pretreatment for through resist metal plating | Steven T. Mayer, Thomas A. Ponnuswamy, Robert Rash, Brian Paul Blackman, Doug Higley | 2017-11-28 |
| 9752248 | Methods and apparatuses for dynamically tunable wafer-edge electroplating | Burhanuddin Kagajwala, Aaron Berke, James Isaac Fortner, Robert Rash | 2017-09-05 |
| 9746427 | Detection of plating on wafer holding apparatus | Steven T. Mayer, Haiying Fu, Thomas A. Ponnuswamy | 2017-08-29 |
| 9732434 | Methods and apparatuses for electroplating nickel using sulfur-free nickel anodes | — | 2017-08-15 |
| 9624592 | Cross flow manifold for electroplating apparatus | Richard Abraham, Steven T. Mayer, Robert Rash | 2017-04-18 |
| 9613833 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack, Steven T. Mayer | 2017-04-04 |
| 9607822 | Pretreatment method for photoresist wafer processing | Mark L. Rea | 2017-03-28 |
| 9587322 | Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath | Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill | 2017-03-07 |
| 9567685 | Apparatus and method for dynamic control of plated uniformity with the use of remote electric current | Burhanuddin Kagajwala, Steven T. Mayer, Lee Peng Chua, Aaron Berke, James Isaac Fortner +1 more | 2017-02-14 |