Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799562 | Vias and conductive routing layers in semiconductor substrates | Sarah A. Niroumand | 2017-10-24 |
| 9653420 | Microelectronic devices and methods for filling vias in microelectronic devices | William M. Hiatt | 2017-05-16 |
| 9646899 | Interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2017-05-09 |
| 9627295 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Anurag Jindal, Jian He, Lalapet Rangan Vasudevan, Hongqi Li | 2017-04-18 |
| 9607930 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2017-03-28 |