Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754825 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Anurag Jindal, Jin Lu, Shyam Ramalingam | 2017-09-05 |
| 9627295 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Anurag Jindal, Jian He, Lalapet Rangan Vasudevan, Kyle K. Kirby | 2017-04-18 |
| 9613864 | Low capacitance interconnect structures and associated systems and methods | Jin Lu, Kevin J. Torek, Thy Tran, Alex J. Schrinsky | 2017-04-04 |
| 9577192 | Method for forming a metal cap in a semiconductor memory device | Muralikrishnan Balakrishnan, Zailong Bian, Gowrisankar Damarla, Jin Lu, Shyam Ramalingam +1 more | 2017-02-21 |