Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9754825 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Hongqi Li, Anurag Jindal, Jin Lu | 2017-09-05 |
| 9577192 | Method for forming a metal cap in a semiconductor memory device | Muralikrishnan Balakrishnan, Zailong Bian, Gowrisankar Damarla, Hongqi Li, Jin Lu +1 more | 2017-02-21 |