Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9841609 | Assembly methods of a SMA assembly and an OIS device | Sidney Chou, Yiu Sing Ho, Kam Fung Yip | 2017-12-12 |
| 9627295 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Anurag Jindal, Lalapet Rangan Vasudevan, Kyle K. Kirby, Hongqi Li | 2017-04-18 |