Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2017-12-05 |
| 9837383 | Interconnect structure with improved conductive properties and associated systems and methods | Wayne H. Huang, James M. Derderian | 2017-12-05 |
| 9818622 | Uniform back side exposure of through-silicon vias | Wayne H. Huang | 2017-11-14 |
| 9768147 | Thermal pads between stacked semiconductor dies and associated systems and methods | Michel Koopmans | 2017-09-19 |
| 9768149 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, James M. Derderian | 2017-09-19 |
| 9741612 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Christopher J. Gambee, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2017-08-22 |
| 9733304 | Semiconductor device test apparatuses | Michel Koopmans, James M. Derderian | 2017-08-15 |
| 9704781 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Christopher J. Gambee, Satish Yeldandi | 2017-07-11 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, James M. Derderian +1 more | 2017-06-27 |
| 9646899 | Interconnect assemblies with probed bond pads | Owen R. Fay, Kyle K. Kirby, Luke England | 2017-05-09 |
| 9564418 | Interconnect structures with intermetallic palladium joints and associated systems and methods | — | 2017-02-07 |