Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837383 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, Wayne H. Huang | 2017-12-05 |
| 9837396 | Stacked semiconductor die assemblies with high efficiency thermal paths and associated methods | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-12-05 |
| 9768149 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2017-09-19 |
| 9733304 | Semiconductor device test apparatuses | Jaspreet S. Gandhi, Michel Koopmans | 2017-08-15 |
| 9691746 | Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths | Sameer S. Vadhavkar, Xiao Li, Steven K. Groothuis, Jian Li, Jaspreet S. Gandhi +1 more | 2017-06-27 |