Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837383 | Interconnect structure with improved conductive properties and associated systems and methods | Jaspreet S. Gandhi, James M. Derderian | 2017-12-05 |
| 9818622 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2017-11-14 |
| 9780052 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Sameer S. Vadhavkar, Anilkumar Chandolu, Mark Bossler | 2017-10-03 |