Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818728 | Interconnect structure with redundant electrical connectors and associated systems and methods | — | 2017-11-14 |
| 9780052 | Collars for under-bump metal structures and associated systems and methods | Giorgio Mariottini, Sameer S. Vadhavkar, Wayne H. Huang, Mark Bossler | 2017-10-03 |
| 9768134 | Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects | Kenneth N. Hagen | 2017-09-19 |