Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9741612 | Semiconductor devices and methods for backside photo alignment | Brandon P. Wirz, Keith E. Ypma, Jaspreet S. Gandhi, Kevin M. Dowdle, Irina Vasilyeva +2 more | 2017-08-22 | $10,704,000 |
| 9704781 | Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods | Brandon P. Wirz, Jaspreet S. Gandhi, Satish Yeldandi | 2017-07-11 | $14,665,000 |