Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9716487 | Latency compensation network using timing slack sensors | Sukeshwar Kannan, Mehdi Sadi | 2017-07-25 |
| 9711494 | Methods of fabricating semiconductor die assemblies | Paul A. Silvestri, Michel Koopmans | 2017-07-18 |
| 9646899 | Interconnect assemblies with probed bond pads | Owen R. Fay, Kyle K. Kirby, Jaspreet S. Gandhi | 2017-05-09 |
| 9613897 | Integrated circuits including magnetic core inductors and methods for fabricating the same | Mahesh Bhatkar, Lulu Peng, Wanbing Yi, Juan Boon Tan | 2017-04-04 |
| 9590028 | Method and device for an integrated trench capacitor | — | 2017-03-07 |
| 9553080 | Method and process for integration of TSV-middle in 3D IC stacks | Ramakanth Alapati | 2017-01-24 |
| 9553058 | Wafer backside redistribution layer warpage control | Rahul Agarwal | 2017-01-24 |
| 9536848 | Bond pad structure for low temperature flip chip bonding | Christian Klewer | 2017-01-03 |