Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659840 | Process flow for a combined CA and TSV oxide deposition | — | 2017-05-23 |
| 9570430 | Articles including bonded metal structures and methods of preparing the same | Frank Kuechenmeister, Jens Oswald | 2017-02-14 |
| 9536848 | Bond pad structure for low temperature flip chip bonding | Luke England | 2017-01-03 |