Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646899 | Interconnect assemblies with probed bond pads | Kyle K. Kirby, Luke England, Jaspreet S. Gandhi | 2017-05-09 |
| 9601374 | Semiconductor die assembly | Liana Foster | 2017-03-21 |
| 9595513 | Proximity coupling of interconnect packaging systems and methods | Rich Fogal | 2017-03-14 |