Issued Patents 2017
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9848492 | Printed circuit board and method of manufacturing the same | Jae Ean LEE, Jee-Soo Mok, Soon-Oh Jung, Kyung Hwan Ko, Yong Ho Baek | 2017-12-19 |
| 9842789 | Electronic component package and method of manufacturing the same | Seung On KANG, Woo-Sung Han, Chul Kyu KIM, Han Kim | 2017-12-12 |
| 9837343 | Chip embedded substrate | Joon-Sung Kim, Yong Ho Baek, Jung-Hyun Cho, Eung-Suek Lee, Jae Hoon Choi | 2017-12-05 |
| 9832866 | Multilayered substrate and method of manufacturing the same | Seok Hwan AHN, Mi Sun Hwang, Jong Seok Bae, Myung Sam Kang | 2017-11-28 |
| 9832856 | Circuit board | Tae Hong Min, Myung Sam Kang | 2017-11-28 |
| 9793250 | Package board, method for manufacturing the same and package on package having the same | Myung Sam Kang, Hye Jin Kim, Hye Won Jung, Min Jae Seong | 2017-10-17 |
| 9741630 | Electronic component package and method of manufacturing the same | Sung Won Jeong | 2017-08-22 |
| 9736939 | Printed circuit board and method of manufacturing printed circuit board | Suk Hyeon Cho, Yong Ho Baek, Yoong Oh, Young Kuk Ko | 2017-08-15 |
| 9736927 | Printed circuit board and method of manufacturing the same | Suk Hyeon Cho, Yoong Oh, Yong Ho Baek, Young Kuk Ko | 2017-08-15 |
| 9699885 | Circuit board including heat dissipation structure | Tae Hong Min, Myung Sam Kang, Min Jae Seong | 2017-07-04 |
| 9655229 | Circuit board | Tae Hong Min, Myung Sam Kang | 2017-05-16 |
| 9578749 | Element embedded printed circuit board and method of manufacturing the same | Jung-Hyun Cho, Yong Ho Baek, Jae Hoon Choi, Jung-Hyun Park | 2017-02-21 |
| 9554466 | Printed circuit board and method of manufacturing the same | Myung Sam Kang, Sang Hoon Kim, Kang Wook Bong, Hye Won Jung, Yong Wan Ji | 2017-01-24 |