Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837343 | Chip embedded substrate | Joon-Sung Kim, Yong Ho Baek, Jung-Hyun Cho, Jae Hoon Choi, Young Gwan Ko | 2017-12-05 |
| 9673066 | Apparatus and method of manufacturing semiconductor package module | No Il Park, Seung Wook Park, Tae Sung Jeong | 2017-06-06 |