Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9848492 | Printed circuit board and method of manufacturing the same | Jae Ean LEE, Jee-Soo Mok, Young Gwan Ko, Soon-Oh Jung, Kyung Hwan Ko | 2017-12-19 |
| 9837343 | Chip embedded substrate | Joon-Sung Kim, Jung-Hyun Cho, Eung-Suek Lee, Jae Hoon Choi, Young Gwan Ko | 2017-12-05 |
| 9831142 | Board for electronic component package, electronic component package, and method of manufacturing board for electronic component package | Jung-Hyun Cho, Jae Hoon Choi | 2017-11-28 |
| 9736927 | Printed circuit board and method of manufacturing the same | Suk Hyeon Cho, Yoong Oh, Young Gwan Ko, Young Kuk Ko | 2017-08-15 |
| 9736939 | Printed circuit board and method of manufacturing printed circuit board | Suk Hyeon Cho, Young Gwan Ko, Yoong Oh, Young Kuk Ko | 2017-08-15 |
| 9578749 | Element embedded printed circuit board and method of manufacturing the same | Jung-Hyun Cho, Young Gwan Ko, Jae Hoon Choi, Jung-Hyun Park | 2017-02-21 |