Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9685401 | Structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Fatima Lina Ayatollahi, Belgacem Haba, Charles G. Woychik +1 more | 2017-06-20 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Ilyas Mohammed, Reynaldo Co, Ellis Chau | 2017-04-04 |
| 9601398 | Thin wafer handling and known good die test method | Charles G. Woychik, Se Young Yang, Pezhman Monadgemi, Cyprian Emeka Uzoh | 2017-03-21 |
| 9583475 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Ilyas Mohammed | 2017-02-28 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Michael Newman | 2017-01-31 |