Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741686 | Electronic package and method of connecting a first die to a second die to form an electronic package | Harold Ryan Chase, Mihir K. Roy | 2017-08-22 |
| 9633938 | Hybrid pitch package with ultra high density interconnect capability | Daniel N. Sobieski, Mihir K. Roy, William J. Lambert | 2017-04-25 |
| 9622350 | Method of forming a circuit board | Mihir K. Roy | 2017-04-11 |
| 9589866 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Zhiguo Qian | 2017-03-07 |
| 9552977 | Landside stiffening capacitors to enable ultrathin and other low-Z products | Mihir K. Roy | 2017-01-24 |