| 9803559 |
Variable vane and seal arrangement |
Andrew D. Burdick, Thomas J. Praisner, Andrew S. Aggarwala, Michael G. McCaffrey |
2017-10-31 |
| 9793126 |
Ion to neutral control for wafer processing with dual plasma source reactor |
Rajinder Dhindsa, Sang Ki Nam, Alexei Marakhtanov |
2017-10-17 |
| 9735020 |
System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas |
— |
2017-08-15 |
| 9673058 |
Method for etching features in dielectric layers |
Scott Briggs, Leonid Belau, John Holland, Mark Wilcoxson |
2017-06-06 |
| 9620377 |
Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch |
Mark Wilcoxson, Kalman Pelhos, Hyung Joo Shin |
2017-04-11 |
| 9548186 |
Methods and apparatus for dual confinement and ultra-high pressure in an adjustable gap plasma chamber |
Andreas Fischer |
2017-01-17 |
| 9543158 |
Technique to deposit sidewall passivation for high aspect ratio cylinder etch |
Nikhil Dole |
2017-01-10 |
| 9543148 |
Mask shrink layer for high aspect ratio dielectric etch |
Mark Wilcoxson, Kalman Pelhos, Hyunjong Shim, Merrett Wong |
2017-01-10 |
| 9536711 |
Method and apparatus for DC voltage control on RF-powered electrode |
Rajinder Dhindsa, Alexei Marakhtanov, Maryam Moravej, Andreas Fischer |
2017-01-03 |
