Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Shariq Siddiqui, Frank W. Mont, Xunyuan Zhang, Brown C. Peethala | 2017-10-24 |
| 9768113 | Self aligned via in integrated circuit | Yannick Feurprier, Joe Lee, Lars Liebmann, Yann Mignot, Terry A. Spooner +1 more | 2017-09-19 |
| 9613862 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss | 2017-04-04 |