Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831124 | Interconnect structures | Xunyuan Zhang | 2017-11-28 |
| 9831174 | Devices and methods of forming low resistivity noble metal interconnect | Xunyuan Zhang, Errol Todd Ryan | 2017-11-28 |
| 9799555 | Cobalt interconnects covered by a metal cap | Xunyuan Zhang | 2017-10-24 |
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Shariq Siddiqui, Xunyuan Zhang, Brown C. Peethala, Douglas M. Trickett | 2017-10-24 |
| 9732427 | Tunable nanoporous films on polymer substrates, and method for their manufacture | David J. Poxson, E. Fred Schubert, Richard W. Siegel | 2017-08-15 |
| 9613862 | Chamferless via structures | Mark L. Lenhardt, Brown C. Peethala, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2017-04-04 |