Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831174 | Devices and methods of forming low resistivity noble metal interconnect | Xunyuan Zhang, Frank W. Mont | 2017-11-28 |
| 9613906 | Integrated circuits including modified liners and methods for fabricating the same | Xunyuan Zhang | 2017-04-04 |
| 9583380 | Anisotropic material damage process for etching low-K dielectric materials | — | 2017-02-28 |
| 9570394 | Formation of IC structure with pair of unitary metal fins | Xunyuan Zhang, Nicholas V. LiCausi | 2017-02-14 |
| 9559059 | Methods of forming an improved via to contact interface by selective formation of a conductive capping layer | Xunyuan Zhang, Tibor Bolom | 2017-01-31 |