Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853115 | Hybrid source and drain contact formation using metal liner and metal insulator semiconductor contacts | Hiroaki Niimi, Tenko Yamashita | 2017-12-26 |
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Frank W. Mont, Xunyuan Zhang, Brown C. Peethala, Douglas M. Trickett | 2017-10-24 |
| 9613862 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Brown C. Peethala, Jessica P. Striss, Douglas M. Trickett | 2017-04-04 |
| 9570344 | Method to protect MOL metallization from hardmask strip process | Vimal Kamineni, Nicholas V. LiCausi, Jeremy A. Wahl | 2017-02-14 |