Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818610 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Katie Lutker-Lee | 2017-11-14 |
| 9768113 | Self aligned via in integrated circuit | Joe Lee, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2017-09-19 |
| 9607834 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Katie Lutker-Lee | 2017-03-28 |