Issued Patents 2016
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9450015 | Manufacturing method of semiconductor structure | Wei-Ming CHIEN, Chia-Sheng Lin, Yen-Shih Ho | 2016-09-20 |
| 9437478 | Chip package and method for forming the same | Yen-Shih Ho, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-09-06 |
| 9425134 | Chip package | Yen-Shih Ho, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2016-08-23 |
| 9419050 | Manufacturing method of semiconductor structure with protein tape | Yen-Shih Ho, Shu-Ming Chang, Yung-Tai Tsai | 2016-08-16 |
| 9406818 | Chip package and method of manufacturing the same | Shu-Ming Chang, Po-Han Lee | 2016-08-02 |
| 9406590 | Chip package and manufacturing method thereof | Chia-Sheng Lin, Yen-Shih Ho | 2016-08-02 |
| 9355975 | Chip package and method for forming the same | Yen-Shih Ho, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-05-31 |
| 9349710 | Chip package and method for forming the same | Chien-Hui Chen, Chun-Wei Chang, Chia-Ming Cheng | 2016-05-24 |
| 9334158 | Chip package and method for forming the same | Yu-Ting Huang, Shu-Ming Chang, Yen-Shih Ho | 2016-05-10 |
| 9331256 | Semiconductor structure with sensor chip and landing pads | Wei-Ming CHIEN, Chia-Sheng Lin, Yen-Shih Ho | 2016-05-03 |
| 9331024 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Yen-Shih Ho, Shu-Ming Chang | 2016-05-03 |
| 9318461 | Wafer level array of chips and method thereof | Chun-Wei Chang, Kuei-Wei Chen, Chia-Ming Cheng, Chia-Sheng Lin, Chien-Hui Chen | 2016-04-19 |
| 9305843 | Chip package and method for forming the same | Bing-Siang Chen, Chien-Hui Chen, Shu-Ming Chang, Yen-Shih Ho | 2016-04-05 |
| 9293394 | Chip package and method for forming the same | Bai-Yao Lou, Chia-Sheng Lin, Tzu-Hsiang Hung | 2016-03-22 |
| 9287417 | Semiconductor chip package and method for manufacturing thereof | Wei-Luen SUEN, Shu-Ming Chang, Yu-Lung Huang, Yen-Shih Ho | 2016-03-15 |
| 9275963 | Semiconductor structure having stage difference surface and manufacturing method thereof | Yung-Tai Tsai, Shu-Ming Chang, Chun-Wei Chang, Chien-Hui Chen, Yen-Shih Ho | 2016-03-01 |
| 9275958 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Shu-Ming Chang, Yen-Shih Ho, Chia-Ming Cheng | 2016-03-01 |
| 9269837 | Chip package and method of manufacturing the same | Shu-Ming Chang, Po-Han Lee | 2016-02-23 |
| 9236320 | Chip package | Yi-Ming Chang, Yen-Shih Ho, Ying-Nan Wen | 2016-01-12 |
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Chih-Wei Ho, Shih-Hsing Chan, Ching-Jui Chuang | 2016-01-05 |