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Integrated circuit comprising buffer chain |
Yi-Lin Chuang, Wei-Pin Changchien, Chin-Her Chien, Nan-Hsin Tseng |
2016-10-25 |
| 9437478 |
Chip package and method for forming the same |
Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +2 more |
2016-09-06 |
| 9425134 |
Chip package |
Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +1 more |
2016-08-23 |
| 9355970 |
Chip package and method for forming the same |
Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN |
2016-05-31 |
| 9355975 |
Chip package and method for forming the same |
Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +2 more |
2016-05-31 |
| 9349710 |
Chip package and method for forming the same |
Tsang-Yu Liu, Chun-Wei Chang, Chia-Ming Cheng |
2016-05-24 |
| 9318461 |
Wafer level array of chips and method thereof |
Chun-Wei Chang, Kuei-Wei Chen, Chia-Ming Cheng, Chia-Sheng Lin, Tsang-Yu Liu |
2016-04-19 |
| 9305843 |
Chip package and method for forming the same |
Bing-Siang Chen, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho |
2016-04-05 |
| 9275963 |
Semiconductor structure having stage difference surface and manufacturing method thereof |
Yung-Tai Tsai, Shu-Ming Chang, Chun-Wei Chang, Tsang-Yu Liu, Yen-Shih Ho |
2016-03-01 |