| 9437478 |
Chip package and method for forming the same |
Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more |
2016-09-06 |
| 9425134 |
Chip package |
Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more |
2016-08-23 |
| 9419050 |
Manufacturing method of semiconductor structure with protein tape |
Yen-Shih Ho, Yung-Tai Tsai, Tsang-Yu Liu |
2016-08-16 |
| 9406818 |
Chip package and method of manufacturing the same |
Tsang-Yu Liu, Po-Han Lee |
2016-08-02 |
| 9373597 |
Chip package and method thereof |
Yen-Shih Ho, Chia-Ming Cheng |
2016-06-21 |
| 9355975 |
Chip package and method for forming the same |
Yen-Shih Ho, Tsang-Yu Liu, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +2 more |
2016-05-31 |
| 9334158 |
Chip package and method for forming the same |
Yu-Ting Huang, Yen-Shih Ho, Tsang-Yu Liu |
2016-05-10 |
| 9331024 |
IC wafer having electromagnetic shielding effects and method for making the same |
Yao-Hsiang Chen, Tsang-Yu Liu, Yen-Shih Ho |
2016-05-03 |
| 9305843 |
Chip package and method for forming the same |
Bing-Siang Chen, Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho |
2016-04-05 |
| 9287417 |
Semiconductor chip package and method for manufacturing thereof |
Wei-Luen SUEN, Yu-Lung Huang, Yen-Shih Ho, Tsang-Yu Liu |
2016-03-15 |
| 9275963 |
Semiconductor structure having stage difference surface and manufacturing method thereof |
Yung-Tai Tsai, Chun-Wei Chang, Chien-Hui Chen, Tsang-Yu Liu, Yen-Shih Ho |
2016-03-01 |
| 9275958 |
Chip package and method for forming the same |
Yi-Min Lin, Yi-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng |
2016-03-01 |
| 9268443 |
Capacitive touch panel with electrode pairs |
Shu-Wen Chang |
2016-02-23 |
| 9269837 |
Chip package and method of manufacturing the same |
Tsang-Yu Liu, Po-Han Lee |
2016-02-23 |