Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406578 | Chip package having extended depression for electrical connection and method of manufacturing the same | Chien-Hung Liu, Ho-Yin Yiu | 2016-08-02 |
| 9379072 | Chip package and method for forming the same | Chien-Hung Liu | 2016-06-28 |
| 9281243 | Chip scale package structure and manufacturing method thereof | Chien-Hung Liu | 2016-03-08 |
| 9236320 | Chip package | Yi-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2016-01-12 |