Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Tsang-Yu Liu, Shih-Hsing Chan, Ching-Jui Chuang | 2016-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Tsang-Yu Liu, Shih-Hsing Chan, Ching-Jui Chuang | 2016-01-05 |