SC

Shih-Hsing Chan

XI Xintec: 1 patents #21 of 41Top 55%
Overall (2016): #232,257 of 481,213Top 50%
1
Patents 2016

Issued Patents 2016

Patent #TitleCo-InventorsDate
9230927 Method of fabricating wafer-level chip package Chuan-Jin Shiu, Tsang-Yu Liu, Chih-Wei Ho, Ching-Jui Chuang 2016-01-05