Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Tsang-Yu Liu, Chih-Wei Ho, Shih-Hsing Chan | 2016-01-05 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9230927 | Method of fabricating wafer-level chip package | Chuan-Jin Shiu, Tsang-Yu Liu, Chih-Wei Ho, Shih-Hsing Chan | 2016-01-05 |