Issued Patents 2016
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502322 | Molding compound supported RDL for IC package | — | 2016-11-22 |
| 9502321 | Thin film RDL for IC package | — | 2016-11-22 |
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2016-11-01 |
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Tzyy-Jang Tseng, Chung W. Ho, Huan-Ling Lee, Sheng-Yuah He | 2016-11-01 |
| 9478472 | Substrate components for packaging IC chips and electronic device packages of the same | — | 2016-10-25 |
| 9460992 | Packaging substrate having a through-holed interposer | Tzyy-Jang Tseng, Ying-Chih Chan | 2016-10-04 |
| 9431335 | Molding compound supported RDL for IC package | — | 2016-08-30 |
| 9385056 | Packaging substrate having embedded interposer and fabrication method thereof | John Hon-Shing Lau | 2016-07-05 |
| 9374896 | Packaging carrier and manufacturing method thereof and chip package structure | Ming-Chih Chen | 2016-06-21 |
| 9368442 | Method for manufacturing an interposer, interposer and chip package structure | Ra-Min Tain, Yu-Hua Chen | 2016-06-14 |
| 9362256 | Bonding process for a chip bonding to a thin film substrate | — | 2016-06-07 |
| 9362140 | Package stack device and fabrication method thereof | — | 2016-06-07 |
| 9357659 | Packaging substrate having embedded through-via interposer | Tzyy-Jang Tseng | 2016-05-31 |
| 9337136 | Method of fabricating a through-holed interposer | Tzyy-Jang Tseng, Ying-Chih Chan | 2016-05-10 |
| 9312219 | Interposer and packaging substrate having the interposer | — | 2016-04-12 |
| 9295163 | Method of making a circuit board structure with embedded fine-pitch wires | — | 2016-03-22 |
| 9282646 | Interposed substrate and manufacturing method thereof | Ming-Chih Chen, Tzyy-Jang Tseng | 2016-03-08 |
| 9263373 | Thin film RDL for nanochip package | — | 2016-02-16 |