Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385056 | Packaging substrate having embedded interposer and fabrication method thereof | Dyi-Chung Hu | 2016-07-05 |
| 9252054 | Thinned integrated circuit device and manufacturing process for the same | Sheng-Tsai Wu, Heng-Chieh Chien, Yu-Lin Chao, Wei-Chung Lo | 2016-02-02 |