Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2016-11-01 |
| 9252054 | Thinned integrated circuit device and manufacturing process for the same | Sheng-Tsai Wu, Heng-Chieh Chien, John Hon-Shing Lau, Yu-Lin Chao | 2016-02-02 |