Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2016-11-01 |
| D768945 | Anti-mildew and antiseptic sticker | — | 2016-10-11 |
| 9368442 | Method for manufacturing an interposer, interposer and chip package structure | Ra-Min Tain, Dyi-Chung Hu | 2016-06-14 |
| 9302151 | Bowed stringed instrument bowing exercise apparatus and manufacturing method thereof | Cheng-Hsiung Lin, Yung-Yu Lin, Kae Han | 2016-04-05 |