Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9510464 | Manufacturing method of circuit board | Shu-Sheng Chiang, Tsung-Yuan Chen | 2016-11-29 |
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Chung W. Ho, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He | 2016-11-01 |
| 9484223 | Coreless packaging substrate and method of fabricating the same | Chung W. Ho | 2016-11-01 |
| 9460992 | Packaging substrate having a through-holed interposer | Dyi-Chung Hu, Ying-Chih Chan | 2016-10-04 |
| 9370107 | Embedded component structure and process thereof | Wei-Ming Cheng | 2016-06-14 |
| 9357659 | Packaging substrate having embedded through-via interposer | Dyi-Chung Hu | 2016-05-31 |
| 9337136 | Method of fabricating a through-holed interposer | Dyi-Chung Hu, Ying-Chih Chan | 2016-05-10 |
| 9282646 | Interposed substrate and manufacturing method thereof | Dyi-Chung Hu, Ming-Chih Chen | 2016-03-08 |
| 9257379 | Coreless packaging substrate and method of fabricating the same | Chung W. Ho | 2016-02-09 |