Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9491871 | Carrier substrate | Chun-Ting Lin | 2016-11-08 |
| 9460992 | Packaging substrate having a through-holed interposer | Tzyy-Jang Tseng, Dyi-Chung Hu | 2016-10-04 |
| 9408313 | Packaging substrate and method of fabricating the same | Chun-Ting Lin | 2016-08-02 |
| 9337136 | Method of fabricating a through-holed interposer | Tzyy-Jang Tseng, Dyi-Chung Hu | 2016-05-10 |