Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484223 | Coreless packaging substrate and method of fabricating the same | Tzyy-Jang Tseng | 2016-11-01 |
| 9485863 | Carrier and method for fabricating coreless packaging substrate | Tzyy-Jang Tseng, Dyi-Chung Hu, Huan-Ling Lee, Sheng-Yuah He | 2016-11-01 |
| 9257379 | Coreless packaging substrate and method of fabricating the same | Tzyy-Jang Tseng | 2016-02-09 |