Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9337168 | Hermetic wafer level packaging | Richard Chu, Martin Liu, Chia-Hua Chu, Yuan-Chih Hsieh, Chung-Hsien Lin +2 more | 2016-05-10 |
| 9275598 | DAC architecture for LCD source driver | Nang-Ping Tu, Fu-Lung Hsueh | 2016-03-01 |
| 9236273 | UV protection for lightly doped regions | Chun-Hao Liao, Chu Fu Chen, Chin-Lung Chen, Victor Chiang Liang | 2016-01-12 |