Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502261 | Spacer etching process for integrated circuit design | Ru-Gun Liu, Cheng-Hsiung Tsai, Chung-Ju Lee, Chia-Ying Lee, Jyu-Horng Shieh +6 more | 2016-11-22 |
| 9478636 | Method of forming semiconductor device including source/drain contact having height below gate stack | Chih-Liang Chen, Kam-Tou Sio, Ru-Gun Liu, Meng-Hung Shen, Chun-Hung Liou +2 more | 2016-10-25 |
| 9449880 | Fin patterning methods for increased process margin | Chin-Yuan Tseng, Chi-Cheng Hung, Chun-Kuang Chen, Huan-Just Lin, Ru-Gun Liu +2 more | 2016-09-20 |
| 9362119 | Methods for integrated circuit design and fabrication | Tsong-Hua Ou, Ken-Hsien Hsieh, Shih-Ming Chang, Wen-Chun Huang, Ru-Gun Liu +1 more | 2016-06-07 |
| 9362169 | Self-aligned semiconductor fabrication with fosse features | Shih-Ming Chang, Ken-Hsien Hsieh, Ming-Feng Shieh, Ru-Gun Liu, Tsai-Sheng Gau | 2016-06-07 |
| 9356021 | Self-alignment for two or more layers and methods of forming same | Shih-Ming Chang, Ru-Gun Liu, Ken-Hsien Hsieh, Ming-Feng Shieh, Tsai-Sheng Gau | 2016-05-31 |
| 9356249 | Organic electronic device and electric field-induced carrier generation layer | Yi-Ming Chang, Chen-Kun Chen | 2016-05-31 |
| 9342116 | Stacked expansion card assembly | Yung-Shun Kao, Hui Ling Chung, Tzu-Hsiang Huang, Ji Su | 2016-05-17 |
| 9337083 | Multi-layer metal contacts | Ming-Feng Shieh, Wen-Hung Tseng, Ken-Hsien Hsieh, Tsai-Sheng Gau, Ru-Gun Liu | 2016-05-10 |
| 9305841 | Method of patterning a feature of a semiconductor device | Yen-Chun Huang, Ming-Feng Shieh, Ken-Hsien Hsieh, Ru-Gun Liu, Tsai-Sheng Gau | 2016-04-05 |
| 9281193 | Patterning method for semiconductor device fabrication | Yen-Chun Huang, Ken-Hsien Hsieh, Ming-Feng Shieh | 2016-03-08 |
| 9281273 | Designed-based interconnect structure in semiconductor structure | Chih-Liang Chen, Yung-Sung Yen, Kam-Tou Sio, Tsong-Hua Ou, Chun-Kuang Chen +3 more | 2016-03-08 |
| 9245763 | Mechanisms for forming patterns using multiple lithography processes | Shih-Ming Chang, Ming-Feng Shieh, Ru-Gun Liu, Tsai-Sheng Gau | 2016-01-26 |