Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502609 | Simplified process for vertical LED manufacturing | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-11-22 |
| 9502278 | Substrate holder assembly for controlled layer transfer | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-11-22 |
| 9455180 | Controlled spalling of fine features | Stephen W. Bedell, Ning Li, Devendra K. Sadana | 2016-09-27 |
| 9404942 | Coaxial probe structure of elongated electrical conductors projecting from a support structure | Brian S. Beaman, Keith E. Fogel, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2016-08-02 |
| 9308714 | Method for improving surface quality of spalled substrates | Stephen W. Bedell, Keith E. Fogel, Devendra K. Sadana | 2016-04-12 |
| 9295166 | Double solder bumps on substrates for low temperature flip chip bonding | Peter A. Gruber, Jae-Woong Nah | 2016-03-22 |
| 9275867 | Method for improving quality of spalled material layers | Stephen W. Bedell, Keith E. Fogel, Ning Li, Devendra K. Sadana, Katherine L. Saenger +1 more | 2016-03-01 |
| 9273408 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Michael A. Gaynes, Jae-Woong Nah | 2016-03-01 |
| 9263363 | Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive | Gareth G. Hougham, Brian R. Sundlof, Jeffrey D. Gelorme | 2016-02-16 |