Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9478486 | Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV | Sun Mi Kim, KyungHoon Lee | 2016-10-25 |
| 9373578 | Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties | DaeSik Choi, SungWon Cho | 2016-06-21 |
| 9293349 | Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield | Sunmi Kim, KyungHoon Lee | 2016-03-22 |
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | WonJun Ko, SeungYong Chai, GwangTae Kim, Kenny Lee | 2016-03-08 |