Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524958 | Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding | JoonYoung Choi, YongHee Kang, KeonTaek Kang, YoungChul Kim | 2016-12-20 |
| 9287204 | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form | KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more | 2016-03-15 |
| 9252130 | Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding | KyungMoon Kim, YoungChul Kim, KeonTaek Kang, HeeJo Chi | 2016-02-02 |
| 9236332 | Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe | Reza A. Pagaila, KiYoun Jang | 2016-01-12 |