Issued Patents 2016
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530719 | Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers | — | 2016-12-27 |
| 9508638 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2016-11-29 |
| 9502347 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Liang Wang, Arkalgud R. Sitaram | 2016-11-22 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Liang Wang, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2016-10-25 |
| 9437536 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2016-09-06 |
| 9412806 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2016-08-09 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Zhuowen Sun, Charles G. Woychik, Arkalgud R. Sitaram | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2016-07-19 |
| 9373181 | System and method for enhanced viewing of rib metastasis | Shuping Qing | 2016-06-21 |
| 9324626 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Liang Wang, Rajesh Katkar | 2016-04-26 |
| 9252127 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2016-02-02 |
| 9231068 | Methods of stress balancing in gallium arsenide wafer processing | — | 2016-01-05 |