Issued Patents 2016
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9355905 | Methods and structure for carrier-less thin wafer handling | Pezhman Monadgemi, Michael Newman, Charles G. Woychik, Terrence Caskey | 2016-05-31 |
| 9349669 | Reduced stress TSV and interposer structures | Charles G. Woychik, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9349614 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Charles G. Woychik | 2016-05-24 |
| 9331043 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Arkalgud R. Sitaram | 2016-05-03 |
| 9323010 | Structures formed using monocrystalline silicon and/or other materials for optical and other applications | Valentin Kosenko, Edward Lee McBain, Pezhman Monadgemi, Sergey Savastiouk | 2016-04-26 |
| 9318385 | Systems and methods for producing flat surfaces in interconnect structures | Vage Oganesian, Ilyas Mohammed | 2016-04-19 |
| 9287164 | Single exposure in multi-damascene process | Vage Oganesian, Ilyas Mohammed, Craig Mitchell, Belgacem Haba | 2016-03-15 |
| 9263394 | Multiple bond via arrays of different wire heights on a same substrate | Rajesh Katkar | 2016-02-16 |
| 9257396 | Compact semiconductor package and related methods | — | 2016-02-09 |
| 9245670 | Reliable wire method | Craig Mitchell | 2016-01-26 |
| 9237648 | Carrier-less silicon interposer | Michael Newman, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2016-01-12 |