Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Jasmeet S. Chawla, Kanwal Jit Singh, Alan M. Myers, Elliot N. Tan | 2016-06-28 |
| 9312204 | Methods of forming parallel wires of different metal materials through double patterning and fill techniques | James S. Clarke, Anthony Schmitz | 2016-04-12 |
| 9236342 | Self-aligned via and plug patterning with photobuckets for back end of line (BEOL) interconnects | Robert L. Bristol, Kevin Lin, Kanwal Jit Singh, Alan M. Myers | 2016-01-12 |