Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9385082 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Christopher J. Jezewski | 2016-07-05 |
| 9379010 | Methods for forming interconnect layers having tight pitch interconnect structures | Christopher J. Jezewski, Kanwal Jit Singh, Alan M. Myers, Elliot N. Tan, Richard E. Schenker | 2016-06-28 |